Apple is set to introduce its first book-style foldable smartphone early next month. The company will market the device as the iPhone Ultra.
It will compete directly with the newly released Samsung Galaxy Z Fold 8. In addition, Apple plans to launch the iPhone 18 Pro and iPhone 18 Pro Max around the same time.
All three models will use Apple’s next-generation A20 Pro chip.
Weeks before the official reveal, alleged images of the iPhone Ultra motherboard have appeared online. These images suggest a redesigned internal layout. As a result, the foldable may manage heat more effectively.
An X user named Lusi Roy recently shared several videos and photos of the purported motherboard. The clips show someone repairing the board and reveal key layout details.
The images place the unreleased A20 Pro chip next to the DRAM modules. Normally, manufacturers stack the chip on top of the memory. Here, the two sit side by side instead.
Apple connects them through a redistribution layer built into the package. This design removes the need for a traditional silicon interposer. Consequently, the phone should deliver better thermal performance.
Further details appear in the photos. The A20 Pro sits near the battery connector. Nearby sit the WLAN and Bluetooth module along with the power amplifier.
Display connectors occupy the bottom section of the board next to the power management chip. The motherboard also includes a dedicated hinge connector and two flex cable connectors.
In addition, the images show two separate boards. One board may sit under each half of the foldable.
Apple is expected to unveil the iPhone Ultra, iPhone 18 Pro, and iPhone 18 Pro Max around September 9. Recent reports also note that the A20 Pro will be Apple’s first chip built on TSMC’s 2-nanometer process. This shift should bring higher performance and improved power efficiency compared with the previous generation.